Introduction
Since August 2020, the government of the People's Republic of China (PRC or China) has issued several new related policy measures to boost the development of its semiconductor and software industries. In August 2020, China's State Council issued the Notice on Several Policies to Promote the High-quality Development of the Integrated Circuit Industry and Software Industry in the New Era, which provides a broad framework.1 In March 2021, the Chinese government issued several implementing measures that include criteria companies must meet to qualify for government preferences, as well as tax and tariff provisions (See Table 1 and Appendix). The Chinese government is expected to issue lists with more details about specific companies, projects, technologies, raw materials, and components that are to be encouraged by the state.
China's new policies encourage U.S. and foreign semiconductor companies—including those from Taiwan, Hong Kong, and Macau—to transfer certain technology, intellectual property (IP), talent, and research and development (R&D) to operations in China. These policies target capabilities across the semiconductor value chain, including integrated circuit (IC) design, fabrication, equipment, software design and tools, packaging and testing, and materials. These policies offer preferential terms over the next ten years—including tax, tariff, financing, and IP protection—for firms willing to establish capabilities, including production facilities, in China. These policies require companies to transfer certain IP—including a specific number of invention patents, depending on the subsector—to ownership by a China-based business that is legally separate from its corporate parent, potentially giving the Chinese government greater control over certain technologies, including through the use of China's new export control law.2
A semiconductor (also known simply as an integrated circuit, a microelectronic chip, or a computer chip) is a tiny electronic device (based primarily on silicon or germanium) composed of billions of components that store, move, and process data. Semiconductors are a uniquely important enabling technology. They are fundamental to nearly all modern industrial and national security activities, and they are essential building blocks of other emerging technologies, such as artificial intelligence, autonomous systems, 5G communications, and quantum computing. For more than six decades, consistent growth in semiconductor capabilities and performance and concurrent cost reductions have boosted U.S. economic output and productivity and enabled new products, services, and industries.3
Many Members of Congress and U.S. policymakers are concerned that China's state-led semiconductor policies, if successful, could lead to the loss of U.S. technological leadership and significantly shift global semiconductor production and related design and research capabilities to China. Chinese semiconductor competencies could support a range of technology advancements, including military applications. Although some countries, including the United States, support their domestic semiconductor industry, the scope and scale of China's state-led efforts are unprecedented when considering the amount of state funding involved, the Chinese government's ambitions to lead across the entire semiconductor value chain, the targeting of U.S. and foreign capabilities, and the particular methods that China is using, which appear to challenge current global rules and norms.4
U.S.-China Phase One Trade Deal Commitments
These new measures build on China's existing state-led semiconductor initiatives by providing new specific technology requirements tied to preferential market treatment and economic benefits.5 In establishing a direct quid pro quo link between technology transfer and qualifications for particular government incentives, China appears to be pursuing trade practices—that previously were detailed in USTR's Section 301 report from March 2018—of concern to the U.S. government and many in Congress.6 Specifically, China's new semiconductor policies may violate provisions in the January 2020, U.S.-China Phase One Trade Deal, particularly in Chapter 2 of the agreement that addressed some aspects of China's technology transfer policies and practices.7 Among related commitments, in Article 2.3 of the agreement, China agreed it would not require or pressure firms to transfer technology in relation to investment transactions, or as a condition for parties to receive or continue to receive any advantages conferred by China.8 In late March 2021, China's planning agency, the National Development and Reform Commission, issued further guidance on the new policies; the guidance clarifies that the Chinese government will require the relevant patents and IP mandated under its measures to be owned by a legally distinct and independent business in China, and cannot be simultaneously owned or controlled outside of China.9 According to these policies, patents and related IP submitted to the Chinese government for review will require government authorization, which creates an opening for the Chinese government to determine and require the specific know-how that companies must transfer to China to meet the policy requirements.
Table 1. Summary of Criteria for Semiconductor and Software Companies to Qualify for Government Preferences
Category |
Requirements |
Business Incorporation |
|
Industrial Policies |
|
Talent |
|
Research and Development (R&D) |
|
Intellectual Property (IP) |
|
Business Environment |
|
Investment, Sales and Income |
|
Source: CRS with information from Conditions for Integrated Circuit Design, Equipment, Materials, Packaging, and Testing Companies Encouraged by the State, draft measures for comment issued by the Ministry of Industry and Information Technology (MIIT) on February 4, 2021; and Notification of the Relevant Requirements for the Development of Lists of Projects and Software Companies, Development and Reform High Technology [2021] No. 413 issued by the National Development and Reform Commission, MIIT, Ministry of Finance, General Administration of Customs, and General Administration of Taxation on March 29, 2021. This analysis is based on an informal translation and review of these documents by the author.
China's Broader Semiconductor Industrial Plans
China's state-led efforts to develop an indigenous and vertically integrated semiconductor industry are unprecedented in scope and scale. In June 2014, the Chinese government published a plan, Guidelines to Promote National Integrated Circuit Industry Development, "with the goal of establishing a world-leading semiconductor industry in all areas of the integrated circuit supply chain by 2030." The document included measures to support an aggressive growth strategy, with the goal of meeting 70% of China's semiconductor demand with domestic production by 2025. In 2019, China revised the goal upward, setting an objective of expanding its domestic production of semiconductors (including from foreign firms in China) to meet 80% of domestic demand by 2030, as part of its Made in China 2025 industrial strategy.10 IC Insights estimate that integrated circuits produced in China accounted for approximately 16% of China's total market, valued at $143.3 billion.11
China's policies feature a substantial and central role for the government in directing and financing Chinese businesses to obtain foreign IP related to semiconductors. The Chinese government uses production targets; subsidies; tax preferences; trade and investment barriers (including pressure to engage in joint ventures); and discriminatory antitrust, IP, procurement, and standards practices. The policies seek to leverage China's central role in global consumer electronics manufacturing and potential as a semiconductor production hub to incentivize and pressure foreign companies to localize production, share technology, and partner with the Chinese government and affiliated entities. To implement its semiconductor plan, China created a government fund—the China Integrated Circuit Investment Industry Fund (CICIIF)—to channel an estimated $150 billion in state funding in support of domestic industry, state-directed overseas acquisitions, and the purchase of foreign semiconductor equipment. In October 2019, China announced a second semiconductor fund with an estimated capitalization of $28.9 billion.12
Main Provisions of the New Measures
The Chinese government appears to be expanding and deepening a statist approach to developing technologies and sectors prioritized in its Made in China 2025 and other industrial plans.13 China's efforts to develop indigenous capabilities have often sought to first obtain the technologies and capabilities it needs from foreign firms. While China is advocating for technology independence in its new 14th Five-Year Plan (2021-2025), details in the new measures show the government is still seeking specific foreign capabilities to fill critical gaps in advancing these goals of technology leadership and independence.14
Although aspects of the new measures show continuity in China's approach to obtain foreign capabilities, they also feature new lines of effort and areas of emphasis. China's current efforts appear to focus on U.S. and foreign technology collaboration that remains unrestricted by the United States and potential countermeasures that seek to work around current U.S. government restrictions on technology ties with China. Overall, the measures reflect a stronger emphasis on foreign R&D collaboration, the use of open source technology platforms, and the use of China's talent programs to attract foreign experts to work in China, all key themes in China's 14th Five-Year Plan.15 The new preferences appear to be more specific to the types and levels of technology that the Chinese government is seeking in an effort to accelerate the development of these capabilities.16 In particular, the policies appear to target the following:
Outlook and Considerations for Congress
Recent congressional initiatives to support the U.S. semiconductor industry stem in part from the challenge that China poses. Issues before Congress include what should be the appropriate role of U.S. government in assisting U.S. industry; how best to focus federal financial assistance; the amount of funding proposed activities would need to accomplish goals for sustaining U.S. semiconductor competitiveness; and how to coordinate and integrate federal activities internally and with initiatives of the U.S. semiconductor and related industries. Legislation was introduced in the 116th Congress (S. 4130 and S. 3933/H.R. 7178), and reintroduced in the 117th Congress (H.R. 7178), to increase federal funding for semiconductor research and development efforts; collaboration between government, industry, and academic partners; and tax credits, grants, and other incentives to spur U.S. production.38
Within these broad considerations for Congress are underlying and overarching questions about how to address China's ambitious industrial plans, trade practices of concern, and the role of U.S. firms and capital in developing China's emerging semiconductor market. China appears to be reinforcing its statist approach to developing its semiconductor industry and is continuing to target U.S. and foreign capabilities in semiconductors and other critical and emerging technologies. In response, Congress might consider whether additional domestic and global measures are needed that would seek to more specifically protect and advance U.S. capabilities and interests vis-a-vis China. Specifically, Congress might consider
Table A-1. Selected Highlights of China's Policies Promoting the Semiconductor and Software Industries
(August 2020)
Measure |
Selected Provisions for Enterprises and Projects Encouraged by the State |
Corporate Income Tax (CIT) |
General:
IC Manufacturing:39
IC Design, Equipment, Software, Materials, and Packing and Testing:
|
Trade and Trade-Related Taxes |
Value Added Tax (VAT)
Import VAT
Import Tariffs
Export Promotion
|
Investment and Financing |
|
R&D |
|
Talent |
|
Intellectual Property Rights (IPR) |
|
Market Considerations |
|
International Cooperation |
|
Supplementary Provisions |
|
Source: CRS with information from the Notice of Several Policies to Promote the High Quality Development of the Integrated Circuit (IC) and Software Industries in the New Era, Guofa [2020] No. 8 issued by the State Council in August 2020; Notice on the Import Tax Policies for Supporting the Development of the Integrated Circuit Industry and the Software Industry, Caishui [2021] No. 4 issued by the Ministry of Finance, the General Administration of Customs, and the State Administration of Taxation on March 16, 2021; and the Notice on the Measures for the Administration of Import Tax Policies to Support the Development of the Integrated Circuit Industry and Software Industry, Caishui [2021] No. 5, issued by the Ministry of Finance, the National Development and Reform Commission, the Ministry of Industry and Information Technology, the General Administration of Customs, and the State Administration of Taxation on March 22, 2021. This analysis is based on an informal translation and review of these documents by the author.
1. |
China's State Council Notice of Several Policies to Promote the High Quality Development of the Integrated Circuit (IC) and Software Industries in the New Era, Guofa [2020] No. 8, August 2020, available in Chinese at http://www.gov.cn/zhengce/content/2020-08/04/content_5532370.htm. |
2. |
China's State Council Notice of Several Policies to Promote the High Quality Development of the Integrated Circuit (IC) and Software Industries in the New Era, Guofa [2020] No. 8, August 2020, paragraph numbers 26 and 38, available in Chinese at http://www.gov.cn/zhengce/content/2020-08/04/content_5532370.htm; Notification of the Relevant Requirements for the Development of Lists of Projects and Software Companies, Development and Reform High Technology [2021] No. 413 (Annex 1 and Annex 3), issued by the National Development and Reform Commission, MIIT, Ministry of Finance, General Administration of Customs, and General Administration of Taxation on March 29, 2021. See CRS Insight IN11524, China Issues New Export Control Law and Related Policies, by Karen M. Sutter. |
3. |
CRS Report R46581, Semiconductors: U.S. Industry, Global Competition, and Federal Policy, by Michaela D. Platzer, John F. Sargent Jr., and Karen M. Sutter |
4. |
OECD, Trade and Agricultural Directorate, Trade Committee, "Measuring Distortions in International Markets: The Semiconductor Value Chain," November 21, 2019. See CRS Report R46581, Semiconductors: U.S. Industry, Global Competition, and Federal Policy, by Michaela D. Platzer, John F. Sargent Jr., and Karen M. Sutter. |
5. |
See CRS Report R46581, Semiconductors: U.S. Industry, Global Competition, and Federal Policy, by Michaela D. Platzer, John F. Sargent Jr., and Karen M. Sutter. |
6. |
Pursuant to Section 301 of the Trade Act of 1974 (19 USC §§2411-2420), USTR concluded that China's policies and practices related to forced technology transfer requirements, cyber-enabled theft of U.S. intellectual property and trade secrets, discriminatory and nonmarket licensing practices, and state-funded strategic acquisition of U.S. assets were unreasonable or discriminatory. See "Findings of the Investigation Into China's Acts, Policies, and Practices Related to Technology Transfer, Intellectual Property, and Innovation Under Section 301 of the Trade Act of 1974," Office of the United States Trade Representative, March 22, 2018, https://ustr.gov/sites/default/files/Section%20301%20FINAL.PDF. |
7. |
See CRS Insight IN11208, U.S. Signs Phase One Trade Deal with China, by Karen M. Sutter. |
8. |
"Economic and Trade Agreement Between the Government of the United States of America and the Government of the People's Republic of China," January 15, 2020, https://ustr.gov/sites/default/files/files/agreements/phase%20one%20agreement/Economic_And_Trade_Agreement_Between_The_United_States_And_China_Text.pdf. |
9. |
"Answers to Relevant Questions About the 'Notice on the Requirements for Creating a List of Integrated Circuit Companies or Projects and Software Companies that Enjoy Preferential Tax Policies," High Technology Division, National Development and Reform Commission, March 31, 2021, https://www.ndrc.gov.cn/xxgk/jd/jd/202103/t20210331_1271319.html. |
10. |
China's State Council, "Guideline for the Promotion of the Development of the National Integrated Circuit Industry," June 2014; China's State Council, "Notice on Issuing Several Policies to Promote the High-Quality Development of the Integrated Circuit Industry and the Software Industry in the New Period," Guofa (2020) 8, August 4, 2020; Center for International Governance Innovation, "Beyond 'Forced' Technology Transfers Analysis of and Recommendations on Intangible Economy Governance in China," CIGI Papers No. 239, March 2020, at https://www.cigionline.org/sites/default/files/documents/no239_2.pdf; John VerWey, "Chinese Semiconductor Industrial Policy: Past and Present," USITC, Journal of International Commerce and Economics, July 2019; and U.S. Chamber of Commerce, Made in China 2025: Global Ambitions Built on Local Protections, 2017, at https://www.uschamber.com/sites/default/files/final_made_in_china_2025_report_full.pdf. |
11. |
Scott Foster, "Get Real about the Chinese Semiconductor Industry," Asia Times, January 18, 2021, https://asiatimes.com/2021/01/get-real-about-the-chinese-semiconductor-industry/. |
12. |
Christopher Thomas, A New World Under Construction: China and Semiconductors, McKinsey & Company, November 2015, at http://www.mckinsey.com/global-themes/asia-pacific/a-new-world-under-construction-china-and-semiconductors; Yoko Kubota, "China Sets up New $29 Billion Semiconductor Fund," Wall Street Journal, October 25, 2019, at https://www.wsj.com/articles/china-sets-up-new-29-billion-semiconductor-fund-11572034480; Tianlei Huang, "Government-Guided Funds in China: Financing Vehicles for State Industrial Policy," China Economic Watch, Peterson Institute for International Economics, June 17, 2019, at https://www.piie.com/blogs/china-economic-watch/government-guided-funds-china-financing-vehicles-state-industrial-policy#_ftn2; and OECD, Trade and Agricultural Directorate, Trade Committee, "Measuring Distortions in International Markets: The Semiconductor Value Chain," November 21, 2019, pp. 94-95. |
13. |
See CRS In Focus IF10964, "Made in China 2025" Industrial Policies: Issues for Congress, by Karen M. Sutter. |
14. |
Xinhua, "Authorized Release from Two Sessions) The 14th Five Year Plan and 2035 Long-Term Development Objectives," March 5, 2020; Xi Jinping, "Certain Major Issues in the National Medium and Long-Term Economic and Social Development Strategy," Qiushi Journal, October 31, 2020. Unofficial English translation available at https://cset.georgetown.edu/research/xi-jinping-certain-major-issues-for-our-national-medium-to-long-term-economic-and-social-development-strategy/. |
15. |
See CRS In Focus IF11684, China's 14th Five-Year Plan: A First Look, by Karen M. Sutter and Michael D. Sutherland. |
16. |
Notice of Several Policies to Promote the High Quality Development of the Integrated Circuit (IC) and Software Industries in the New Era, Guofa [2020] No. 8, China's State Council, August 2020; Notice on the Import Tax Policies for Supporting the Development of the Integrated Circuit Industry and the Software Industry, Caishui [2021] No. 4, China's Ministry of Finance, the General Administration of Customs, and the State Administration of Taxation, March 16, 2021; and Notice on the Measures for the Administration of Import Tax Policies to Support the Development of the Integrated Circuit Industry and Software Industry, Caishui [2021] No. 5, China's Ministry of Finance, the National Development and Reform Commission, the Ministry of Industry and Information Technology, the General Administration of Customs, and the State Administration of Taxation, March 22, 2021. |
17. |
Sam Reynolds, "Taiwan Prosecutors Accuse China's Bitmain of Illegally Poaching TSMC, MediaTek Engineers," WCCF Tech Inc., March 9, 2021, https://wccftech.com/19-taiwanese-chip-engineers-detained-for-working-for-chinese-front-company/. |
18. |
"Measuring Distortions in International Markets: The Semiconductor Value Chain," Trade and Agricultural Directorate, Trade Committee, OECD, November 21, 2019, pp. 94-95, http://www.oecd.org/officialdocuments/publicdisplaydocumentpdf/?cote=TAD/TC(2019)9/FINAL&docLanguage=En. |
19. |
Office of the U.S. Trade Representative, "2020 Report to Congress on China's WTO Compliance," January 2021, https://ustr.gov/sites/default/files/files/reports/2020/2020USTRReportCongressChinaWTOCompliance.pdf; "Made in China 2025: Global Ambitions Built on Local Protections," U.S. Chamber of Commerce, 2017, https://www.uschamber.com/sites/default/files/final_made_in_china_2025_report_full.pdf; and "Countering China: Ensuring America Remains the World Leader in Advanced Technologies and Innovation," Written Testimony from the Semiconductor Industry Association, Hearing by the House of Representatives Committee on Oversight and Government Reform, Subcommittee on Information Technology, September 26, 2018, https://republicans-oversight.house.gov/wp-content/uploads/2018/09/Neuffer-SIA-Statement-China-9-26.pdf. |
20. |
Stephen Ezell, "Moore's Law Under Attack: The Impact of China's Policies on Global Semiconductor Innovation," February 18, 2021, Information Technology and Innovation Foundation, https://itif.org/publications/2021/02/18/moores-law-under-attack-impact-chinas-policies-global-semiconductor: Dorcas Wong, "How Can Foreign Technology Investors Benefit from China's New Infrastructure Plan?," China Briefing, Dezan Shira and Associates, August 7, 2020, https://www.china-briefing.com/news/how-foreign-technology-investors-benefit-from-chinas-new-infrastructure-plan/. Also see CRS In Focus IF11684, China's 14th Five-Year Plan: A First Look, by Karen M. Sutter and Michael D. Sutherland. |
21. |
"China Chipmaker SMIC to Invest in $2.35 billion facilities in Shenzhen," Reuters, March 17, 2021, https://www.reuters.com/article/us-smic-shenzhen/china-chipmaker-smic-to-invest-in-2-35-billion-facilities-in-shenzhen-idUSKBN2B9250. |
22. |
Stu Woo and Yuko Kubota, "Chinese Chip Makers Get Biggest Stake Boost, Report Finds," The Wall Street Journal, December 12, 2019, https://www.wsj.com/articles/chinese-chip-makers-get-biggest-state-boost-report-finds-11576164610. |
23. |
Xu Wei, "South Korea Probe Casts Doubt on Chinese Fund Wise Road's USD 1.4 Billion Magnachip Takeover," Yicai Global, March 31, 2021, https://www.yicaiglobal.com/news/south-korean-probe-casts-doubt-on-chinese-fund-wise-road-usd14-billion-magnachip-takeover-. |
24. |
"Huawei to Build an Optoelectronics R&D and Manufacturing Centre in Cambridge," Huawei Company Press Release, June 25, 2020, https://www.huawei.com/us/news/2020/6/huawei-optoelectronics-rd-manufacturing-centre-cambridge. |
25. |
Jeffrey Burt, "Alibaba on the Bleeding Edge of RISC-V with XT910," The Next Platform, August 21, 2020, https://www.nextplatform.com/2020/08/21/alibaba-on-the-bleeding-edge-of-risc-v-with-xt910/. For a list of RISC-V's international members, see https://riscv.org/members/. For the latest version of the U.S. Department of Commerce's Entity List, see https://www.bis.doc.gov/index.php/documents/regulations-docs/2326-supplement-no-4-to-part-744-entity-list-4/file. |
26. |
School of Microelectronics, University of Chinese Academy of Sciences (CAS), Institute of Microelectronics, CAS website at http://english.ime.cas.cn/et/. |
27. |
Rachel Zhang and Teddy Ng, "China's Tech Push Includes Plans to Lure More Skilled Migrants," South China Morning Post, March 10, 2021, https://www.scmp.com/news/china/diplomacy/article/3124886/chinas-tech-push-includes-plans-lure-more-skilled-migrants. |
28. |
Kensaku Ihara, "Taiwan Loses 3,000 Chip Engineers to 'Made in China 2025'," Nikkei Asia, December 3, 2019, https://asia.nikkei.com/Business/China-tech/Taiwan-loses-3-000-chip-engineers-to-Made-in-China-2025. |
29. |
Josh Ye, Semiconductor Giant SMIC Rewards Senior Taiwanese Executive with Hefty Compensation as China Builds Up Chip Sector's Hi-Tech Talent Pool," South China Morning Post, April 7, 2021, https://www.scmp.com/tech/big-tech/article/3128650/semiconductor-giant-smic-rewards-senior-taiwanese-executive-hefty; Cheng Ting-Fang, "China's Top Chipmaker Hires Sought-After former TSMC Executive," Nikkei Asia, December 16, 2020, https://asia.nikkei.com/Business/China-tech/China-s-top-chipmaker-hires-sought-after-former-TSMC-executive. |
30. |
Chester Yung and Archie van Riemskijk, "NXP Semiconductors Sells Unit to Chinese Firm for $1.8 Billion," The Wall Street Journal, May 28, 2015, https://www.wsj.com/articles/nxp-semiconductors-sells-unit-to-chinese-firm-for-1-8-billion-1432812018. |
31. |
Noel Randewich and Matthew Miller, " Qualcomm to Pay $975 million to Resolve China Antitrust Dispute," Reuters, February 9, 2015, https://www.reuters.com/article/us-china-qualcomm/qualcomm-to-pay-975-million-to-resolve-china-antitrust-dispute-idUSKBN0LD2EL20150210, and "Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China," Qualcomm Press Release, January 17, 2016, https://www.qualcomm.com/news/releases/2016/01/16/qualcomm-and-guizhou-province-sign-strategic-cooperation-agreement-and-form. |
32. |
"Applied Materials Terminates $2.2 Billion Deal for Japan's Kokusai Electric," Reuters, March 29, 2021, https://www.reuters.com/article/us-kokusai-m-a-applied-materials/applied-materials-terminates-2-2-billion-deal-for-japans-kokusai-electric-idUSKBN2BL1I4; "Nvidia's Acquisition of ARM Throws Company into Tech Spat Between U.S. and China," Reuters, September 14, 2020, https://www.reuters.com/article/arm-holdings-ma-nvidia-china/analysis-nvidia-acquisition-of-arm-throws-company-into-tech-spat-between-u-s-and-china-idUSL4N2GB1JG. |
33. |
"AMEC Wins Injunction in Patent Infringement Dispute Involving Veeco Instruments (Shanghai) Co., Ltd, ," PR Newswire, December 8, 2017, https://www.prnewswire.com/news-releases/amec-wins-injunction-in-patent-infringement-dispute-involving-veeco-instruments-shanghai-co-ltd-300569295.html; "Veeco, AMEC and SGL Settle MOCVD Wafer Carrier Patent Litigation," Semiconductor Today, February 8, 2018, http://www.semiconductor-today.com/news_items/2018/feb/veeco-amec-sgl_080218.shtml; and "Micron Provides Statement on Fujian Province Patent Litigation," Micron Company News Release, July 5, 2018, https://investors.micron.com/news-releases/news-release-details/micron-provides-statement-fujian-province-patent-litigation. |
34. |
Ramish Zafar, "U.S. Chip Firms to Coordinate with Chinese Firms on IP Security, Other Areas," WCCF Tech Inc., March 11, 2021, https://wccftech.com/u-s-chip-firms-to-coordinate-with-chinese-firms-on-ip-security-other-areas/. |
35. |
Dieter Ernst, "China's Bold Strategy for Semiconductors—Zero-Sum Game or Catalyst for Cooperation?," Innovation and Economic Growth Series No. 9, East-West Center Working Papers, September 2016, https://www.eastwestcenter.org/system/tdf/private/iegwp009_0.pdf?file=1%26type=node%26id=3579; "About CSIA," China Semiconductor Industry Association website at http://www.csia.net.cn/wsc/AboutCSIA.asp. |
36. |
"CSIA Leadership," CSIA website at http://www.csia.net.cn/wsc/CSIALeadership.asp. |
37. |
"CSIA Membership," CSIA website at http://www.csia.net.cn/wsc/CSIAMembership.asp. For the latest version of the U.S. Department of Commerce's Entity List, see https://www.bis.doc.gov/index.php/documents/regulations-docs/2326-supplement-no-4-to-part-744-entity-list-4/file. |
38. |
For a full discussion of issues and considerations for Congress, see CRS Report R46581, Semiconductors: U.S. Industry, Global Competition, and Federal Policy, by Michaela D. Platzer, John F. Sargent Jr., and Karen M. Sutter. |
39. |
Feature size describes the size of the transistor gate length as measured in billionths of a meter, or nanometers (nm). |